Description
Product Introduction
Introducing the SoFix S-BGN2 MiNi BGA Heating Station, a state-of-the-art tool designed for precision motherboard repairs and upgrades. This versatile station is equipped to handle a variety of tasks, including replacing the CPU, graphics card, PCH, upgrading memory and SSDs, and removing the T2 chip. With its advanced soldering and heating capabilities, the S-BGN2 ensures that your motherboard maintenance is efficient and effective.
Product usage:
1.S-BGN2 is used to fix the motherboard and provide a heating function for the motherboard
2. It can be used for replacement of large and small CPUs, graphics cards, PCHs, memory/SSDs, and removing the T2 chip.
3.Supports BGA chip disassembly and assembly of MacBook, iPad logic board, Windows notebooks, tablets, etc.
4.Auxiliary heating/Removal of high-temperature solder, Replacement of BGA processors, Fixing motherboard/Convenient removal of black glue from BGA chip
Platform Working Modes
1. Baking Board
Baking motherboard
Auxiliary heating for cleaning high-temperature
solder from pads
Remove RAM/T2 chips
General high-temperature applications
2. CPU/PCH
Welding large processors (e.g., Intel CPUs, M1 Pro/Max, M2 Pro/Max)
Welding GPUs (graphics card chips).
3. Small CPU/PCH
Welding small processors (e.g., A1932/A2179, M1/M2/M3)
Welding Platform Controller Hubs (PCH)
4. Pause/Return
Pause: Stops or starts the current process
Return: Long press to return to the home page
Interface Functions:
ON/OFF: Switch key (Controls the main power input on and off)
AC~INPUT (110V-220V): AC power input, Supports 110V and 220V specifications
30:00: 30-minute power protection. The power is automatically cut off after 30 minutes of working. Heats for a long time
RESET: The button resets the host's status. After pressing the “RESET” button, the host will return to the working state.
Specifications of SoFix S-BGN2
Brand: SoFix
Model: S-BGN2
Product Name: Mini BGA Heating Station
Main Use: Preheating/Desoldering
Input Voltage: 110/220V
Temperature Regulation: 0 to 400°C
Scope of application: Preheated soldering of electronic products and PCB
