Description
Highlights at a glance
High temp resistant synthetic stone base, heat insulation, dirt-proof and easy to clean, long service life for repair shop.Equipped with 0.15mm spacer, supports MTK, Kirin, Qualcomm, Samsung mobile CPU multi-model reballing.
Shock-absorbing rubber foot pads, anti-slip & anti-aging, stabilizes the platform when doing precise chip tin planting.
Powerful built-in magnet, solid adsorption, convenient to take and place stencil, greatly improves reballing efficiency.
Precise positioning design, reduces tin bridging & offset, helps technicians get uniform tin balls on CPU chips.
