Description
0.008mm 50M/200M Silver Jumper Wire for Mobile Phone Motherboard Chip Welding Repair PCB Repair Link Wire Soldering Tool
Silver Jumper Wire Description:
- Mobile Phone Motherboard Repair BGA Desoldering wire
- Absorption wire Soldering Accessory assistant for removing unwanted solder Quickly.
- Sucking line BGA Desoldering Solder Wire BGA Tin Absorption line.
- Desoldering Wire Solder wick Except for the tin absorbing excess solder.
- Silver BGA Desoldering wire - Quickly removes unwanted solder
- When used with a soldering iron, improve Your mobile phone PCB Desoldering Process.
Features:
- High efficiency and save the electric repairing time.
- Avoid the high temperature destruction of electric pad.
- Design in precision,guarantee the max surface tension and the ability of absorbing tin.
- Speed up the speed of absorbing tin and low residue of flux.
- Increase the speed of cleaning the PCB pad.
- Oxidation resistivity and anti-corrosion protection,good thermal conductivity.
