Description
2UUL BH17 CPU Reball Base Magnetic Dual-Sided Reballing Platform CPU StencilX75 Qualcomm Exynos IP MTK HiSiicon EMMC+RAM CPU Reballing
Magnetic Dual-Sided Reballing Platform Setfor Phone CPU For Android iPhone
Stencil X 75PCS:
Qualcomm x17PCS
Exynos x 11PCS
IP x 12PCS
MTK x 14PCS
HiSiicon x9PCS
EMMC+RAM x 12PCS






