Description
RELIFE RL-601T 22 in 1 iPhone X~15 Pro Max Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit
22-in-1 Middle Layer Board Plant Tin
Product Model:iphone XXS/XS Max11/ 11Pro/11 Pro Max/12/12Mini/12 Pro/12 Pro Max
13/13Mini13 Pro/13 Pro Max14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max
Product Information:
Brand: RELIFE
Name：Middle Tinning Platform Set
Model No.: RL-601T
Net weight: approx. 373g
Gross weight: about 443g
Product size “105*65*12/160*60*10mm
Stencil thickness: 0.12mm
Packing list: Base*1 / Module clamp*5 / Stencil*17
Product Advantage:
Precision hole spacing design: high quality steel, round square precise holes, make the tin ball more rounded, prevent the mesh from jamming the tin ball!
Tin balls are even and full: anti-drumming, so that each tin ball is rounded and full, to meet the needs of various chips!
High-temperature resistant synthetic stone: high-quality environmentally friendly stone, high strength, engaged in dirt, easy to clean!
Anti-slip rubber feet: wear-resistant and anti-slip, shock absorption, anti-pressure, anti-aging