Description
Highlights at a glance
New adhesive removal slot: larger and more stablePrecise fixturing: V-groove design with offset fixing angles ensures optimal clearance and firm fixturing
High compatibility: Bidirectional adjustment,compatible with chipsets and motherboards
Heat resistance up to 500°C: high-temperature-resistant composite stone, excellent heat dissipation, durable, non-deforming, and heat-resistant
Compact and portable: Suitable for clamping and repairing various mobile phone motherboards, CPU chips, and other components











